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opa330 opa2330 opa4330 www.ti.com sbos432e C august 2008 C revised february 2011 50 v v os , 0.25 v/ c, 35 a cmos operational amplifiers zer ? -drift series check for samples: opa330 , opa2330 , opa4330 1 features description 23 ? unmatched price performance the opa330 series of cmos operational amplifiers offer precision performance at a very competitive ? low offset voltage: 50 v (max) price. these devices are members of the zer ? -drift ? zero drift: 0.25 v/ c (max) family of amplifiers which use a proprietary ? low noise: 1.1 v pp , 0.1hz to 10hz auto-calibration technique to simultaneously provide ? quiescent current: 35 a (max) low offset voltage (50 v max) and near-zero drift over time and temperature at only 35 a (max) of ? supply voltage: 1.8v to 5.5v quiescent current. the opa330 family features ? rail-to-rail input/output rail-to-rail input and output in addition to near flat 1/f ? internal emi filtering noise, making this amplifier ideal for many applications and much easier to design into a system. ? micro size packages: wcsp, sc70, qfn these devices are optimized for low-voltage operation as low as +1.8v ( 0.9v) and up to +5.5v applications ( 2.75v). ? battery-powered instruments the opa330 (single version) is available in the ? temperature measurements wcsp-5, sc70-5, sot23-5, and soic-8 packages. ? transducer applications the opa2330 (dual version) is offered in dfn-8 ? electronic scales (3mm 3mm), msop-8, and soic-8 packages. the ? medical instrumentation opa4330 is offered in the standard soic-14 and tssop-14 packages, as well as in the space-saving ? handheld test equipment vqfn-14 package. all versions are specified for ? current sense operation from C 40 c to +125 c. product family package comparison package-leads no of device channels wcsp soic sot23 sc70 msop qfn tssop opa330 1 5 8 5 5 C C C opa2330 2 C 8 C C 8 8 C opa4330 4 C 14 C C C 14 14 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 nanostar, nanofree are trademarks of texas instruments incorporated. 3 all other trademarks are the property of their respective owners. production data information is current as of publication date. ? 2008 C 2011, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters.
opa330 opa2330 opa4330 sbos432e C august 2008 C revised february 2011 www.ti.com this integrated circuit can be damaged by esd. texas instruments recommends that all integrated circuits be handled with appropriate precautions. failure to observe proper handling and installation procedures can cause damage. esd damage can range from subtle performance degradation to complete device failure. precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. package information (1) product package-lead package designator package marking sot23-5 dbv ocfq sc70-5 dck chl opa330 soic-8 d o330a wcsp-5 yff oeh soic-8 d o2330a opa2330 dfn-8 drb ocgq msop-8 dgk ocgq soic-14 d o4330a opa4330 tssop-14 pw o4330a qfn-14 rgy 4330a (1) for the most current package and ordering information, see the package option addendum at the end of this document, or visit the device product folder at www.ti.com . absolute maximum ratings (1) over operating free-air temperature range, unless otherwise noted. opa330, opa2330, opa4330 unit supply voltage, v s = (v+) C (v C ) +7 v signal input terminals, voltage (2) (v C ) C 0.3 to (v+) + 0.3 v signal input terminals, current (2) 10 ma output short-circuit (3) continuous operating temperature C 40 to +150 c storage temperature C 65 to +150 c junction temperature +150 c human body model (hbm) 4000 v esd charged device model (cdm) 1000 v ratings: machine model (mm) 400 v (1) stresses above these ratings may cause permanent damage. exposure to absolute maximum conditions for extended periods may degrade device reliability. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2) input terminals are diode-clamped to the power-supply rails. input signals that can swing more than 0.3v beyond the supply rails should be current limited to 10ma or less. (3) short-circuit to ground, one amplifier per package. 2 submit documentation feedback ? 2008 C 2011, texas instruments incorporated product folder link(s): opa330 opa2330 opa4330
opa330 opa2330 opa4330 www.ti.com sbos432e C august 2008 C revised february 2011 thermal information opa330aid(r) opa330aidbvr(t) opa330aidckr(t) opa330aiyff thermal metric (1) d dbv dck yff units 8 pins 5 pins 5 pins 5 pins ja junction-to-ambient thermal resistance 140.1 220.8 298.4 130 jctop junction-to-case (top) thermal resistance 89.8 97.5 65.4 54 jb junction-to-board thermal resistance 80.6 61.7 97.1 51 c/w jt junction-to-top characterization parameter 28.7 7.6 0.8 1 jb junction-to-board characterization parameter 80.1 61.1 95.5 50 jcbot junction-to-case (bottom) thermal resistance n/a n/a n/a n/a (1) for more information about traditional and new thermal metrics, see the ic package thermal metrics application report, spra953 . thermal information opa2330aid(r) opa2330aidgkr(t) opa2330aidrbr(t) thermal metric (1) d dgk drb units 8 pins 8 pins 8 pins ja junction-to-ambient thermal resistance 124.0 180.3 46.7 jctop junction-to-case (top) thermal resistance 73.7 48.1 26.3 jb junction-to-board thermal resistance 64.4 100.9 22.2 c/w jt junction-to-top characterization parameter 18.0 2.4 1.6 jb junction-to-board characterization parameter 63.9 99.3 22.3 jcbot junction-to-case (bottom) thermal resistance n/a n/a 10.1 (1) for more information about traditional and new thermal metrics, see the ic package thermal metrics application report, spra953 . thermal information opa4330aid opa4330aipw opa4330airgy thermal metric (1) d pw rgy units 14 pins 14 pins 14 pins ja junction-to-ambient thermal resistance 83.8 120.8 49.2 jctop junction-to-case (top) thermal resistance 70.7 34.3 75.3 jb junction-to-board thermal resistance 59.5 62.8 61.9 c/w jt junction-to-top characterization parameter 11.6 1.0 1.2 jb junction-to-board characterization parameter 37.7 56.5 19.3 jcbot junction-to-case (bottom) thermal resistance n/a n/a 4.6 (1) for more information about traditional and new thermal metrics, see the ic package thermal metrics application report, spra953 . ? 2008 C 2011, texas instruments incorporated submit documentation feedback 3 product folder link(s): opa330 opa2330 opa4330
opa330 opa2330 opa4330 sbos432e C august 2008 C revised february 2011 www.ti.com electrical characteristics: v s = +1.8v to +5.5v boldface limits apply over the specified temperature range, t a = C 40 c to +125 c. at t a = +25 c, r l = 10k ? connected to midsupply, v cm = v out = midsupply, unless otherwise noted. opa330, opa2330, opa4330 parameter test conditions min typ max unit offset voltage input offset voltage v os v s = +5v 8 50 v vs temperature dv os /dt 0.02 0.25 v/ c vs power supply psrr v s = +1.8v to +5.5v 1 10 v/v long-term stability (1) see (1) channel separation, dc 0.1 v/v input bias current input bias current i b 200 500 pa input bias current: opa330yff, opa4330 70 300 pa over temperature 300 pa input offset current i os 400 1000 pa input offset current: opa330yff, opa4330 140 600 pa noise input voltage noise density e n f = 1khz 55 nv/ hz input voltage noise f = 0.01hz to 1hz 0.3 v pp input voltage noise f = 0.1hz to 10hz 1.1 v pp input current noise i n f = 10hz 100 fa/ hz input voltage range common-mode voltage range v cm (v C ) C 0.1 (v+) + 0.1 v common-mode rejection ratio cmrr (v C ) C 0.1v < v cm < (v+) + 0.1v 100 115 db common-mode rejection ratio: (v C ) C 0.1v < v cm < (v+) + 0.1v, v s = 5.5v 100 115 db opa330yff, opa4330 input capacitance differential 2 pf common-mode 4 pf open-loop gain (v C ) + 100mv < v o < (v+) C 100mv, open-loop voltage gain a ol 100 115 db r l = 10k ? frequency response gain-bandwidth product gbw c l = 100pf 350 khz slew rate sr g = +1 0.16 v/ s output voltage output swing from rail 30 100 mv short-circuit current i sc 5 ma capacitive load drive c l see typical characteristics open-loop output impedance f = 350khz, i o = 0 2 k ? power supply specified voltage range v s 1.8 5.5 v quiescent current per amplifier i q i o = 0 21 35 a turn-on time v s = +5v 100 s (1) 300-hour life test at +150 c demonstrated randomly distributed variation of approximately 1 v. 4 submit documentation feedback ? 2008 C 2011, texas instruments incorporated product folder link(s): opa330 opa2330 opa4330
opa330 opa2330 opa4330 www.ti.com sbos432e C august 2008 C revised february 2011 electrical characteristics: v s = +1.8v to +5.5v (continued) boldface limits apply over the specified temperature range, t a = C 40 c to +125 c. at t a = +25 c, r l = 10k ? connected to midsupply, v cm = v out = midsupply, unless otherwise noted. opa330, opa2330, opa4330 parameter test conditions min typ max unit temperature range specified range C 40 +125 c operating range C 40 +150 c storage range C 65 +150 c thermal resistance ja c/w sot23-5 200 c/w msop-8, soic-8, tssop-14 150 c/w dfn-8 50 c/w sc70-5 250 c/w wcsp-5 130 c/w pin configurations opa330 opa330 sot23-5 sc70-5 (top view) (top view) opa330 opa330 soic-8 wcsp-5 (top view) (top view) (1) nc denotes no internal connection. ? 2008 C 2011, texas instruments incorporated submit documentation feedback 5 product folder link(s): opa330 opa2330 opa4330 12 3 54 v+out +in v - - in in - in+ out v s - v + s c3 b2 a3 c1 a1 12 3 4 87 6 5 nc (1) v+out nc (1) nc (1) - in +in v - 12 3 54 v+- in out v - +in
opa330 opa2330 opa4330 sbos432e C august 2008 C revised february 2011 www.ti.com pin configurations, continued opa2330 opa2330 soic-8, msop-8 dfn-8 (top view) (top view) opa4330 opa4330 soic-14 qfn-14 (top view) (top view) opa4330 tssop-14 (top view) (2) connect thermal die pad to v C . 6 submit documentation feedback ? 2008 C 2011, texas instruments incorporated product folder link(s): opa330 opa2330 opa4330 1 2 3 4 5 6 7 8 14 1312 11 10 9 v+ +in b - in b out b +in a - in a out a +in c - in c out c +in d - in d out dv - 12 3 4 5 6 7 v+ +in b - in b out b +in a - in a out a +in c - in c out c +in d - in d out dv - 1413 12 11 10 98 d a b c 12 3 4 87 6 5 v+out b - in b +in b out a - in a +in a v - a b 14 1 8 7 - in a +in a v+ +in b - in b - in d +in d v - +in c- in c out a out b out d out c exposed thermal die pad on underside (2) 23 5 6 4 1312 10 9 11 12 3 4 87 6 5 v+out b - in b +in b out a - in a +in a v - exposed thermal die pad on underside (2)
opa330 opa2330 opa4330 www.ti.com sbos432e C august 2008 C revised february 2011 typical characteristics at t a = +25 c, c l = 0pf, r l = 10k ? connected to midsupply, v cm = v out = midsupply, unless otherwise noted. offset voltage production distribution open-loop gain vs frequency figure 1. figure 2. common-mode rejection ratio vs frequency power-supply rejection ratio vs frequency figure 3. figure 4. output voltage swing vs output current input bias current vs common-mode voltage figure 5. figure 6. ? 2008 C 2011, texas instruments incorporated submit documentation feedback 7 product folder link(s): opa330 opa2330 opa4330 population - 15.00 - 18.00 - 21.00 - 12.00 - 9.00 - 6.00 - 3.00 0 3.006.00 9.00 12.0015.00 18.00 21.00 24.00 offset voltage ( v) m - 24.00 210 205 200 195 190 - 190 - 195 - 200 - 205 - 210 0 1 2 3 4 5 common-mode voltage (v) i (pa) b - i b +i b a (db) ol 10 120100 8060 40 20 0 - 20 phase ( ) 250200 150 100 50 0 - 50 - 100 100k 10k 1k 100 frequency (hz) 1m phase gain cmrr (db) 1 140120 100 8060 40 20 0 100k 10k 1k 100 10 frequency (hz) 1m output swing (v) 0 32 1 0 - 1 - 2 - 3 1 output current (ma) 10 7 8 9 6 5 4 3 2 - 40 c - 40 c - 40 c +25 c +25 c +25 c +125 c +125 c v = 2.75v s v = 0.9v s psrr (db) 1 120100 8060 40 20 0 10k 100k 1k 100 10 frequency (hz) 1m +psrr - psrr
opa330 opa2330 opa4330 sbos432e C august 2008 C revised february 2011 www.ti.com typical characteristics (continued) at t a = +25 c, c l = 0pf, r l = 10k ? connected to midsupply, v cm = v out = midsupply, unless otherwise noted. input bias current vs temperature quiescent current vs temperature figure 7. figure 8. large-signal step response small-signal step response figure 9. figure 10. positive over-voltage recovery negative over-voltage recovery figure 11. figure 12. 8 submit documentation feedback ? 2008 C 2011, texas instruments incorporated product folder link(s): opa330 opa2330 opa4330 i (pa) b - 50 250200 150 100 50 0 50 100150 200 250 - - -- - - 25 temperature ( c) 125 100 75 50 25 0 v = 5.5v s v = 1.8v s - i b - i b +i b +i b 2v/div 0 1v/div 0 time (50 s/div) m input output 10k w 1k w opa330 +2.5v - 2.5v output voltage (1v/div) time (50 s/div) m g = 1 r = 10k w l i ( a) m q - 50 2520 15 10 50 - 25 temperature ( c) 125 100 75 50 25 0 v = 1.8v s v = 5.5v s 2v/div 0 1v/div 0 time (50 s/div) m input output 10k w 1k w opa330 +2.5v - 2.5v output voltage (50mv/div) time (5 s/div) m g = +1 r = 10k w l
opa330 opa2330 opa4330 www.ti.com sbos432e C august 2008 C revised february 2011 typical characteristics (continued) at t a = +25 c, c l = 0pf, r l = 10k ? connected to midsupply, v cm = v out = midsupply, unless otherwise noted. settling time vs closed-loop gain small-signal overshoot vs load capacitance figure 13. figure 14. current and voltage noise spectral density 0.1hz to 10hz noise vs frequency figure 15. figure 16. input bias current vs input differential voltage figure 17. ? 2008 C 2011, texas instruments incorporated submit documentation feedback 9 product folder link(s): opa330 opa2330 opa4330 input bias current ( a) m 5040 30 20 10 0 1020 30 40 50 -- - - - - 1v input differential voltage (mv) - 400 - 600 - 200 0 400 200 600 800 - 800 normal operating range(see the section in the applications information) input differential voltage over-driven condition over-driven condition settling time ( s) m 1 600500 400 300 200 100 0 10 gain (db) 100 0.001% 0.01% 4v step voltage noise (nv/ ) ? hz 1 1000 100 10 current noise (fa/ ) ? hz 1000100 10 1k 100 10 frequency (hz) 10k current noise voltage noise continues with no 1/f (flicker) noise. 500nv/div 1s/div overshoot (%) 10 4035 30 25 20 15 10 50 100 load capacitance (pf) 1000
opa330 opa2330 opa4330 sbos432e C august 2008 C revised february 2011 www.ti.com applications information the opa330, opa2330, and opa4330 are unity-gain input differential voltage stable, precision operational amplifiers free from the typical input bias current of the opa330 during unexpected output and phase reversal. the use of normal operation is approximately 200pa. in proprietary zer ? -drift circuitry gives the benefit of low over-driven conditions, the bias current can increase input offset voltage over time and temperature, as significantly (see figure 17 ).the most common cause well as lowering the 1/f noise component. as a result of an over-driven condition occurs when the op amp of the high psrr, these devices work well in is outside of the linear range of operation. when the applications that run directly from battery power output of the op amp is driven to one of the supply without regulation. the opa330 family is optimized rails the feedback loop requirements cannot be for low-voltage, single-supply operation. these satisfied and a differential input voltage develops miniature, high-precision, low quiescent current across the input pins. this differential input voltage amplifiers offer high-impedance inputs that have a results in activation of parasitic diodes inside the front common-mode range 100mv beyond the supplies end input chopping switches that combine with 10k and a rail-to-rail output that swings within 100mv of electromagnetic interference (emi) filter resistors to the supplies under normal test conditions. the create the equivalent circuit shown in figure 19 . opa330 series are precision amplifiers for notice that the input bias current remains within cost-sensitive applications. specification within the linear region. operating voltage the opa330 series op amps can be used with single or dual supplies from an operating range of v s = +1.8v ( 0.9v) up to +5.5v ( 2.75v). supply voltages greater than +7v can permanently damage the device. see the absolute maximum ratings table. key parameters that vary over the supply voltage or figure 19. equivalent input circuit temperature range are shown in the typical characteristics section of this data sheet. internal offset correction input voltage the opa330, opa2330, and opa4330 op amps use the opa330, opa2330, and opa4330 input an auto-calibration technique with a time-continuous common-mode voltage range extends 0.1v beyond 125khz op amp in the signal path. this amplifier is the supply rails. the opa330 is designed to cover zero-corrected every 8 s using a proprietary the full range without the troublesome transition technique. upon power-up, the amplifier requires region found in some other rail-to-rail amplifiers. approximately 100 s to achieve specified v os accuracy. this design has no aliasing or flicker noise. typically, input bias current is about 200pa; however, input voltages exceeding the power supplies can emi susceptibility and input filtering cause excessive current to flow into or out of the input pins. momentary voltages greater than the operational amplifiers vary in their susceptibility to power supply can be tolerated if the input current is emi. if conducted emi enters the operational limited to 10ma. this limitation is easily accomplished amplifier, the dc offset observed at the amplifier with an input resistor, as shown in figure 18 . output may shift from its nominal value while the emi is present. this shift is a result of signal rectification associated with the internal semiconductor junctions. while all operational amplifier pin functions can be affected by emi, the input pins are likely to be the most susceptible. the opa330 operational amplifier family incorporates an internal input low-pass filter that reduces the amplifier response to emi. both common-mode and differential mode filtering are provided by the input filter. the filter is designed for a cutoff frequency of approximately 8mhz ( C 3db), with a roll-off of 20db per decade. figure 18. input current protection 10 submit documentation feedback ? 2008 C 2011, texas instruments incorporated product folder link(s): opa330 opa2330 opa4330 core - in +in clamp 10k w 10k w 5k w opa330 10ma max +5v v in v out i overload current-limiting resistor required if input voltage exceeds supply rails by3 0.3v.
opa330 opa2330 opa4330 www.ti.com sbos432e C august 2008 C revised february 2011 achieving output swing to the op the opa330, opa2330, and opa4330 have an amp negative rail output stage that allows the output voltage to be pulled to its negative supply rail, or slightly below, some applications require output voltage swings from using the technique previously described. this 0v to a positive full-scale voltage (such as +2.5v) technique only works with some types of output with excellent accuracy. with most single-supply op stages. the opa330, opa2330, and opa4330 have amps, problems arise when the output signal been characterized to perform with this technique; the approaches 0v, near the lower output swing limit of a recommended resistor value is approximately 20k ? . single-supply op amp. a good single-supply op amp note that this configuration will increase the current may swing close to single-supply ground, but will not consumption by several hundreds of microamps. reach ground. the output of the opa330, opa2330, accuracy is excellent down to 0v and as low and opa4330 can be made to swing to ground, or as C 2mv. limiting and nonlinearity occurs slightly below, on a single-supply power source. to below C 2mv, but excellent accuracy returns as the do so requires the use of another resistor and an output is again driven above C 2mv. lowering the additional, more negative, power supply than the op resistance of the pull-down resistor will allow the op amp negative supply. a pull-down resistor may be amp to swing even further below the negative rail. connected between the output and the additional resistances as low as 10k ? can be used to achieve negative supply to pull the output down below the excellent accuracy down to C 10mv. value that the output would otherwise achieve, as shown in figure 20 . application circuits figure 21 shows the basic configuration for a bridge amplifier. a low-side current shunt monitor is shown in figure 22 . figure 20. for v out range to ground figure 21. single op amp bridge amplifier note: 1% resistors provide adequate common-mode rejection at small ground-loop errors. figure 22. low-side current monitor ? 2008 C 2011, texas instruments incorporated submit documentation feedback 11 product folder link(s): opa330 opa2330 opa4330 r 1 v ex v out v ref r 1 opa330 r r r r +5v opa330 ads1100 load v i c 2 r 1 4.99k w r 3 4.99k w r 4 48.7k w r 2 49.9k w +5v 3v ref3130 r 7 1.18k w r shunt 1 w r 6 71.5k w r n 56 w r n 56 w (pga gain = 4)fs = 3.0v stray ground-loop resistance i load v out r = 20k w p op amp v = gnd - opa330 v in v+ = +5v - 5v additional negative supply
opa330 opa2330 opa4330 sbos432e C august 2008 C revised february 2011 www.ti.com r n are operational resistors used to isolate the following these guidelines reduces the likelihood of ads1100 from the noise of the digital i 2 c bus. junctions being at different temperatures, which can because the ads1100 is a 16-bit converter, a precise cause thermoelectric voltages of 0.1 v/ c or higher, reference is essential for maximum accuracy. if depending on materials used. absolute accuracy is not required, and the 5v power supply is sufficiently stable, the ref3130 may be opa330 wcsp omitted. the opa330 yff package is a lead- (pb-) free, figure 23 shows the opa330 in a typical thermistor die-level, wafer chip-scale package (wcsp). unlike circuit. devices that are in plastic packages, these devices have no molding compound, lead frame, wire bonds, or leads. using standard surface-mount assembly procedures, the wcsp can be mounted to a printed circuit board (pcb) without additional underfill. figure 24 and figure 25 detail the pinout and package marking, respectively. see the nanostar ? and nanofree ? 300 m solder bump wcsp application note (sbva017) for more detailed information on package characteristics and pcb design. figure 23. thermistor measurement general layout guidelines attention to good layout practice is always recommended. keep traces short and, when possible, use a printed circuit board (pcb) ground plane with surface-mount components placed as close to the device pins as possible. place a 0.1 f capacitor closely across the supply pins. these guidelines should be applied throughout the analog circuit to improve performance and provide benefits such as reducing the electromagnetic interference figure 24. wcsp pin description (emi) susceptibility. for lowest offset voltage and precision performance, circuit layout and mechanical conditions should be optimized. avoid temperature gradients that create thermoelectric (seebeck) effects in the thermocouple junctions formed from connecting dissimilar conductors. these thermally-generated potentials can be made to cancel by assuring they are equal on both input terminals. other layout and design considerations include: ? use low thermoelectric-coefficient conditions (avoid dissimilar metals). ? thermally isolate components from power figure 25. yff package marking supplies or other heat sources. ? shield op amp and input circuitry from air currents, such as cooling fans. 12 submit documentation feedback ? 2008 C 2011, texas instruments incorporated product folder link(s): opa330 opa2330 opa4330 in - in+ out v s - v + s c3 b2 a3 c1 a1 yff package wcsp-5 (top view) (bump side down; not to scale) opa330 3v 1m w 60k w 100k w 1m w ntcthermistor actual size: exact size (max): 0,862 mm x 1,156 mm yff package wcsp-5 enlarged image (top view) (bump side down) package marking code: ymd = year/month/day tbd = indicates opa330aiyff s = for engineering purposes only ymdtbds
opa330 opa2330 opa4330 www.ti.com sbos432e C august 2008 C revised february 2011 photosensitivity the qfn and dfn package can be easily mounted using standard pcb assembly techniques. see although the opa330 yff package has a protective application note qfn/son pcb attachment backside coating that reduces the amount of light ( slua271 ) and application report quad flatpack exposure on the die, unless fully shielded, ambient no-lead logic packages ( scba017 ), both available light can reach the active region of the device. input for download at www.ti.com . bias current for the package is specified in the absence of light. depending on the amount of light the exposed leadframe die pad on the bottom of exposure in a given application, an increase in bias the package should be connected to v C . current, and possible increases in offset voltage should be expected. fluorescent lighting may qfn and dfn layout guidelines introduce noise or hum because of the time-varying the leadframe die pad should be soldered to a light output. best layout practices include end-product thermal pad on the pcb. a mechanical data sheet packaging that provides shielding from possible light showing an example layout is attached at the end of sources during operation. this data sheet. refinements to this layout may be required based on assembly process requirements. qfn and dfn packages mechanical drawings located at the end of this data the opa4330 is offered in a qfn package. the sheet list the physical dimensions for the package opa2330 is available in a dfn-8 package (also and pad. the five holes in the landing pattern are known as son), which is a qfn package with lead optional, and are intended for use with thermal vias contacts on only two sides of the bottom of the that connect the leadframe die pad to the heatsink package. these leadless, near-chip-scale packages area on the pcb. maximize board space and enhance thermal and soldering the exposed pad significantly improves electrical characteristics through an exposed pad. board-level reliability during temperature cycling, key qfn and dfn packages are physically small, have a push, package shear, and similar board-level tests. smaller routing area, improved thermal performance, even with applications that have low-power and improved electrical parasitics, with a pinout dissipation, the exposed pad must be soldered to the scheme that is consistent with other commonly-used pcb to provide structural integrity and long-term packages, such as soic and msop. additionally, the reliability. absence of external leads eliminates bent-lead issues. ? 2008 C 2011, texas instruments incorporated submit documentation feedback 13 product folder link(s): opa330 opa2330 opa4330
opa330 opa2330 opa4330 sbos432e C august 2008 C revised february 2011 www.ti.com revision history note: page numbers for previous revisions may differ from page numbers in the current version. changes from revision d (june 2010) to revision e page ? changed document status from mixed status to production data ....................................................................................... 1 ? deleted footnote 2 from the package information table ....................................................................................................... 2 ? added remaining thermal information data ........................................................................................................................... 3 changes from revision c (october 2009) to revision d page ? added last applications bullet ............................................................................................................................................... 1 ? deleted footnote 1 from product family package comparison table ................................................................................... 1 ? deleted footnote 2 and shading from all packages except qfn-14; moved wcsp-5, soic-14, and tssop-14 packages to production data status; and added package marking information to package information table ................... 2 ? added opa330yff, opa4330 input bias current parameter to electrical characteristics table ....................................... 4 ? added input voltage range, opa330yff, opa4330 common-mode rejection ratio parameter to electrical characteristics table ............................................................................................................................................................. 4 ? moved tssop-14 thermal resistance to msop-8, soic-8 thermal resistance parameter in electrical characteristics table ...................................................................................................................................................................................... 5 ? deleted soic-14 and qfn-14 rows from temperature range section in electrical characteristics table .......................... 5 14 submit documentation feedback ? 2008 C 2011, texas instruments incorporated product folder link(s): opa330 opa2330 opa4330
package option addendum www.ti.com 21-feb-2011 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ ball finish msl peak temp (3) samples (requires login) opa2330aid active soic d 8 75 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa2330aidg4 active soic d 8 75 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa2330aidgkr active msop dgk 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa2330aidgkrg4 active msop dgk 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa2330aidgkt active msop dgk 8 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa2330aidgktg4 active msop dgk 8 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa2330aidr active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa2330aidrbr active son drb 8 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa2330aidrbrg4 active son drb 8 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa2330aidrbt active son drb 8 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa2330aidrbtg4 active son drb 8 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa2330aidrg4 active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa330aid active soic d 8 75 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa330aidbvr active sot-23 dbv 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa330aidbvrg4 active sot-23 dbv 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa330aidbvt active sot-23 dbv 5 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa330aidbvtg4 active sot-23 dbv 5 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim
package option addendum www.ti.com 21-feb-2011 addendum-page 2 orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ ball finish msl peak temp (3) samples (requires login) opa330aidckr active sc70 dck 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa330aidckrg4 active sc70 dck 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa330aidckt active sc70 dck 5 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa330aidcktg4 active sc70 dck 5 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa330aidg4 active soic d 8 75 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa330aidr active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa330aidrg4 active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim OPA330AIYFFR active dsbga yff 5 3000 green (rohs & no sb/br) snagcu level-1-260c-unlim opa330aiyfft active dsbga yff 5 250 green (rohs & no sb/br) snagcu level-1-260c-unlim opa4330aid active soic d 14 50 green (rohs & no sb/br) cu nipdau level-2-260c-1 year opa4330aidr active soic d 14 2500 green (rohs & no sb/br) cu nipdau level-2-260c-1 year opa4330aipw active tssop pw 14 90 green (rohs & no sb/br) cu nipdau level-2-260c-1 year opa4330aipwr active tssop pw 14 2000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year opa4330airgyr active vqfn rgy 14 3000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year opa4330airgyt active vqfn rgy 14 250 green (rohs & no sb/br) cu nipdau level-2-260c-1 year (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device.
package option addendum www.ti.com 21-feb-2011 addendum-page 3 (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant opa2330aidgkr msop dgk 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 q1 opa2330aidgkt msop dgk 8 250 330.0 12.4 5.3 3.4 1.4 8.0 12.0 q1 opa2330aidr soic d 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 q1 opa2330aidrbr son drb 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 q2 opa2330aidrbt son drb 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 q2 opa330aidbvr sot-23 dbv 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 q3 opa330aidbvt sot-23 dbv 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 q3 opa330aidckr sc70 dck 5 3000 179.0 8.4 2.2 2.5 1.2 4.0 8.0 q3 opa330aidckt sc70 dck 5 250 179.0 8.4 2.2 2.5 1.2 4.0 8.0 q3 opa330aidr soic d 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 q1 OPA330AIYFFR dsbga yff 5 3000 180.0 8.4 0.97 1.27 0.73 4.0 8.0 q1 opa330aiyfft dsbga yff 5 250 180.0 8.4 0.97 1.27 0.73 4.0 8.0 q1 opa4330aidr soic d 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 q1 opa4330aipwr tssop pw 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 q1 opa4330airgyr vqfn rgy 14 3000 330.0 12.4 3.75 3.75 1.15 8.0 12.0 q1 opa4330airgyt vqfn rgy 14 250 180.0 12.4 3.75 3.75 1.15 8.0 12.0 q1 package materials information www.ti.com 19-feb-2011 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) opa2330aidgkr msop dgk 8 2500 364.0 364.0 27.0 opa2330aidgkt msop dgk 8 250 364.0 364.0 27.0 opa2330aidr soic d 8 2500 346.0 346.0 29.0 opa2330aidrbr son drb 8 3000 346.0 346.0 29.0 opa2330aidrbt son drb 8 250 190.5 212.7 31.8 opa330aidbvr sot-23 dbv 5 3000 203.0 203.0 35.0 opa330aidbvt sot-23 dbv 5 250 203.0 203.0 35.0 opa330aidckr sc70 dck 5 3000 203.0 203.0 35.0 opa330aidckt sc70 dck 5 250 203.0 203.0 35.0 opa330aidr soic d 8 2500 346.0 346.0 29.0 OPA330AIYFFR dsbga yff 5 3000 190.5 212.7 31.8 opa330aiyfft dsbga yff 5 250 190.5 212.7 31.8 opa4330aidr soic d 14 2500 346.0 346.0 33.0 opa4330aipwr tssop pw 14 2000 346.0 346.0 29.0 opa4330airgyr vqfn rgy 14 3000 346.0 346.0 29.0 opa4330airgyt vqfn rgy 14 250 190.5 212.7 31.8 package materials information www.ti.com 19-feb-2011 pack materials-page 2

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